Carsem offers a wide variety of SOP (Small Outline Package) in the popular “gull-wing” lead format. It is one of the most commonly used surface mount packages today.
Application
Use for wide range of devices packaging ex. ASIC, Power, MEMS, Hall Sensor, Digital Isolators, Switching etc in Commercial, Industrial & Automotive Segments.
Package Portfolio
Note:
SOICN/W Lead pitching 1.27mm
QSOP Lead pitching 0.65mm
Features / Offers
- Standard JEDEC package outlines
- Moisture Sensitivity Level 1 & Grade 0 bill of Material Available
- One Stop Assembly & Test (Turnkey) Facilities
- Wire Interconnect in both Gold & Copper Wires
- Leadframe Roughening for Reliability Enhancement
- Exposed Pad Option for Thermal Enhancement
- AOI & Enhanced Traceability for Automotive products
- Pb-free and RoHS compliant
Multi Chip Package
Increase functionality with same foot print
- Multi chip up to 6 dies (2D)
- Stack die (2.5D)
- Die to Die wire bond
FCOL Capability
Maximized Die to Package Ratio
- Flip Chip Process
- Screen printing
- DAF laminated
Customize Package
Customized POD for Special application needs
- Exposed pad option
- Inverted Forming
- Zero stand off
- Straight leads
- Pre-mold Cavity for MEMS
Carsem offers a wide variety of SOP (Small Outline Package) in the popular “gull-wing” lead format. HVM for both Automotive & Commercial market.
Please find below SOP variations availability
Some of these packages are also available in below configurations
Flip Chip ( Solder Bump & Copper Pillar )
Chip on Lead ( COL )
Multiple Die & Passive Module Packaging
Stack Die
Thermal Enhanced Package ( Exposed Pad Features )
Availability
| Package Type | Description | Lead Count |
| SOICN | Small Outline Integrated Circuit (150mils) | 8/14/16 |
| SOICW | Small Outline Integrated Circuit (300mils) | 16/20/24/28 |
| QSOP | Quarter-pitch Small outline Package | 16/20/24/28 |
| MSOP | Mini Small Outline Package | 8/10 |
| SSOP | Shrink Small Outline Package | 20/24/28 |
| TSSOP | Thin Shrink Small Outline Package | 8/14/16/20/24/28/38 |
Note : Specialized in Custom Package Outline to meet customer requirement for automotive application. Please contact or email to sales office
Bill Of Material & Reliability Performance
Carsem offer standard material for low cost and high MSL performance.
Support specific or non standard bill of material to meet customer requirement
Reliability & MSL Results
| Please Contact Sales Office for Package Specific Results |