M – Site
Founded in 1972, M – Site, Malaysia was acquired by Hong Leong Group in June 1984. The factory has a total floor space of 436,000 sq. ft. (40,500 m²). M-Site is focused on Assembly only and Final Electrical Test on the products is supported at S – Site.
Product Groups Assembled at M – Site:
| I.C. | SOICN (150 mils), SOICW (300 mils), QSOP (150 mils), MSOP(8L), MSOP(10L), SSOP, TSSOP |
| MICRO | SC70 (3L), SC70 (4L), SC70 (5L), SC70 (6L), SOT23 (3L), SOT23 (5L), SOT23 (6L), SOT23 (8L), TSOT (5L), TSOT (6L), TSOT (8L) |
| POWER | SOT223, TO220(3L), TO220(5L), TO220(7L), DDPAK (TO263)(3L), DDPAK (TO263)(5L), DDPAK (TO263)(7L), PDFN 5×6 |
| M.S.U | LGA / MIS (from 2mm x 2mm – 10mm x 10mm), MLP (from 2mm x 2mm – 10mm x 10mm), Customized Cavity Package, Over mold packages on substrate and lead frame. |
Suzhou – Site
Carsem Suzhou, China commenced production in July 2004. The factory has a total floor space of 600K sq. ft. (56,000 m²). SZ – Site is focused on assembly and test for the MLP-Micro Leadframe Package (QFN Format) and Laminate products.
Product Groups Assembled at SZ – Site:
| MLP | QUAD, DUAL (Saw version) |
| LGA | Land Grid Array |
| FC | Flip Chip |
| TVS | Transient Voltage Suppressor |
| Copper Clip | Copper Clip |
| SIP | System in Package |
S – Site
S – Site, Malaysia commenced operations in April,1992. The factory has a total floor space of 640,000 sq. ft. (60,000 m²). S – Site supports Assembly and Final Electrical Test for both M – Site and S – Site.
Product Groups Assembled at S – Site:
| MLP | QUAD, DUAL (Saw version) |
| SiP | System in Package |
| I.C. | PDIP (300Mil), QSOP (300Mil) |
| QFP | MQFP, LQFP |
| Copper Clip | Copper Clip |