Carsem R&D focusses to formulate and implement strategies for new packages, assembly technology and materials to enhance manufacturing capability. Our efforts in development create value & differentiation through packaging design / process technology / custom solution.
MLP Cu Clip : MLP Copper Clip
Available in Punched and Sawn MLP
Carsem’s Cu Clip assemblies can significantly improve the electrical and thermal performance of Mosfets and other Power Devices. The Cu Clip, when soldered to the top surface of the die, can typically replace 20~30 two mils Au wires.
Carsem is in high volume production on punched MLP with Cu clips for a number of years. Recently Carsem has expanded this capability to sawn MLP as well as multi-clip MLP-SiP assemblies.
Cu WB : Copper Wire Bond
Has been in high volume production since 2008.
X3 : Super Small X3 Package
World’s smallest plastic molded package. 0.6 x 0.3x 0.3mm MLP
SiP : System in Package
Carsem’s SiP(System in Package) is the advanced technology of placing multiple ICs and passive components into a single package. We are one of the world’s leading manufacturers of SiP modules and our services include design, modeling as well as final test including RF testing of Bluetooth and WLAN applications.
FCOL™ : Flip Chip on Leadframe
Carsem’s patent pending FCOLTM (Flip Chip On Leadframe) is the process of flipping a bumped die with pad pitches as small as 8 mils (200 microns) onto a lead frame and then molding it using standard plastic package assembly process. FCOL™ is available in standard packages such as MLP, SOT23, SC70, TSOT, QSOP and narrow body SOICs.
COL : Chip On Lead
Mounting a die directly to the lead fingers with non-conductive epoxy. The product is then wire bonded & molded into standard package configurations.