Micro offers a wide range of package portfolios, with an array of leaded packages for the manufacturers of discrete devices as well as ICs. It ranges from Small Outline Transistors (SOT23/SC70) to Small Outline Packages (SSOP/TSSOP/MSOP) to Power Management packages (T0220/DDPAK/SOT223/MLP Punched) to Customized packages (UB/UC/UE/LS/LR/OMP/SMP). Most discrete packages are available in the conventional and COL configurations. Some of these packages are also available in FCOL configurations.
Carsem offers a wide variety of leaded industry standard packages for the manufacturers of discrete devices, passives, and low lead count IC devices. Packages. HVM for both Automotive & Commercial market.
Most Micro Packages are available in traditional and COL configurations. Some of these packages are also available in below configurations
- Flip Chip ( Solder Bump & Copper Pillar )
- Chip on Lead ( COL )
- Multiple Die
- Stack Die
Note : Specialized in Custom Package Outline to meet customer requirement for automotive application. Please contact or email to sales office
Availability
| Package Type | Description | Lead Count |
| SOT23 | Small Outline Transistor | 3/5/6/8 |
| TSOT | Thin Small Outline Transistor | 5/6/8 |
| SC70 (SOT323) | Shrink SOT Package | 3/4/5/6 |
Bill Of Material & Reliability Performance
Carsem offer standard material for low cost and high MSL performance.
Support specific or non standard bill of material to meet customer requirement
Reliability & MSL Results
| Please Contact Sales Office for Package Specific Results |