LGA (Land Grid Array) is substrate based package with rectangular grid of contacts at the underside. LGA can be electrically connected to a PCB either by the use of a socket or by solder paste directly.
Product Feature
- High density & Routing able VS QFN
- Low cost and widely applications
- Flexible lead layout array and substrate routing
- Wide choice of paddle sizes
Application
Applicable for a wide range of semiconductor device types in consumer market such as Switch, LNA, Filter, WLAN, Bluetooth TM, MEMS production.
MEMS
3-axis acceleration sensor, measures acceleration along all 3 axis (X, Y, Z), specifically designed for low-power, and available in small and thin LGA packages.
Micro Phone
Shielded metal CAP :
