Power Management

Power Management is the system which manages transitions between standby, sleep and high power modes by effectively delivering optimal electrical power to the various components in a system resulting in longer standby power and generally, the efficient use of available energy.

• Power management devices are important for portable products that rely on battery power – networking and computing, wireless, automotive and motor control applications
• By reducing power to components that aren’t being used, a good power management system can extend the lifetime of a battery.

Carsem offers various solutions for Power Management.

• Improved MOSFET performance with lower RDSon
• Enhanced thermal performance
• Cost effectiveness to replace 20~30 heavy Au wires

• Cu Clip products are used where power & thermal efficiency is critical
• Commercial & Industrial applications
• Motherboards, LED TV, laptop, small electric vehicles
• Electronics in Server, Automation, Photo Voltaic etc.

• Multiple Cu Clip MOSFETs capability
• Exposed Cu Clip option
• High thermal conductive adhesives
• One-stop from design to HVM (high volume manufacturing)
• Full turnkey solutions for assembly & test

Carsem’s FCOL^TM (Flip Chip On Leadframe) comes with a flipped bump-die with pad pitches as small as 200 microns onto a lead frame.

• Reduced form factors
• Improves electrical performance
• Improved thermal conductivity

• Allows maximum use of silicon space
• FCOL™ is available in MLP, SOT23, SC70, QSOP and narrow body SOICs.
• Ideal for RF & power management devices

• 60% improvement in self-inductance and capacitance versus awire bonded version.
• 15% lower thermal resistance.
• Reduced resistance from typical 19 m-ohm to 0.6 m-ohm
• MSL Level 1.
• Withstands 260°C solder shock test.
• Complete Assembly & Test Solution including RF testing, tape and reel plus drop ship.
• Improve heat dissipation through expose die back structure
• Direct flip FET process (without pre-formed solder bumps)