Tooling Engineer (Semiconductor)
Direct (Permanent / Fixed Term)
Ipoh, Perak, Malaysia
Posted 6 years ago
Job Summary:
Support all technical drawings for lead frame, package outline, bond diagram, …etc in business and project development organization. Responsible for drafting technical drawings, review, approve and release the final drawing in the system.
Responsibilities:
- Create technical drawings 2D or 3D model using Solidworks software for
- Lead frame drawing
- Package outline drawing
- Bond diagram drawing
- Apply Carsem drawing and assembly design rule guideline to create technical drawing
- Review, asses and validate drawing with the requester or direct to customer either in meeting or conference call
- Validate lead frame design and manufacturing capability with supplier
- Verify and approve lead frame drawing for new tooling
- Release final drawing in system
- Any other duties assigned by immediate superior
Requirements:
- Bachelor’s Degree in Mechanical Engineering, Electronic & Electronic Engineering, Process Engineering
- More than 5 years of drafting of technical drawing for semiconductor industry
- Possess knowledge in Solidwork, AutoCAD Mechanical Deskstop (or other compatible Cad drawing) and technical drawing
- Understand or trained & Apply Design FMEA into new design
- Working in Semiconductor leadframe / substrate company will have added advantages
- Knowledge on Assembly packaging process either or both FOL or/& EOL processes
Job Features
| Job Category | General |
| Job Field | Tooling Engineer (Semiconductor) |
| Location | Jelapang, Perak |
| Years of Experience | Min 3 years (Junior Executive) |

