Overview
Semiconductor Test is playing a critical role in the manufacturing process to ensure parts delivered to customer to be defect-free. It needs to ensure that no devices that have been damaged along the packaging processes being escaped to the field. Only good device that pass the final test will be proceed to be sealed and packed as per commercial goods ready for sale. As the product designs become more heterogeneous, number of tests required is growing and it turn test to be a portfolio of separate operation.
As a leading provider of turnkey packaging & test services to the semiconductor industry, Carsem offering one of the largest packages & test portfolio in the world for last 45 years. Carsem Test is facilitated over 2 plants, Carsem Ipoh (S-Site), Malaysia and Carsem Suzhou, China respectively.
With a vast range of equipment as well as a strong and dedicated operation team, Carsem Test provides a full range of test services to meet the unique needs of our customer’s device requirements. Carsem Test is emphasizing on the continuous improvements on all aspects to provide advanced technology, quality, performance and cost of test.
Full turnkey Solution with accurate and thorough services
Carsem Test Team with extensive experience and capability is ready to provide a full range of test services, covering both the “front-end” process through wafer probing, as well as the “back-end” process, which includes final testing on assembled device.
As a Test solution partner, we offered services which includes:
- Test consultation & development services for both new products and platform migration
- Wafer Probing services
- Final testing from simplest open/short test on singulated units to advanced package testing with fully automated machine, high parallelism testing, strip testing, burn in, reliability testing & etc.
- A full suite of optimized post-test services including tape-and-reel, baking, pack & labelling, drop-ship service with short cycle time & rapid delivery of the final products to the end customer