Technical Sales Engineer (Semiconductor)

Job Summary
The incumbent is accountable to support & providing a technical support function includes customer
service and liaise with factory and overseas offices.

Job Responsibility

• Key Roles & Responsibilities Guideline for Engineering Manager (rev1.2) – Current focus will be Development Projects
• Ability to evaluate New Project justification both technically & commercially:
• Design feasibility – Packaging, Assembly Processes, Equipment Capability/type, Material selection, RFQ/Costing, Timeline, etc.
• Reference to structure need, there may or may not be direct subordinates. In any situation, need to possess managerial & leadership capability on direct & non-direct report, provide guidance, overcome barriers.
• NPI (New Project Introduction) management from start until release to production. Manage & Track project status and react to potential delay or issue raised.
• Design innovation to compete in technology field, patent proposal as arises.
• Direct communication with customers on new project technical/ criteria/ spec/ productivity/ timeline review & agreement.
• A project driver with organization skill to closely follow-up all critical actions, ability to execute actions being carried out by team members both direct & non-direct report, also supporting resources & suppliers.
• Substrate Design/ Development/ Packaging/ Process flow/ BOM/ Assembly experience & advance packaging knowledge definitely added advantage.
• To assess feasibility & soundness of proposed experiment, techniques, equipment, processes, especially when information/ data is insufficient, or confirmation needed thru testing/ evaluation.
• Ability to Multi-Task, Prioritization, Periodic update, Execution of projects to meet customers’ expectations.
• when re-scheduling/ delay of timeline arises (due to internal or customer) – to provide justification on delay, early notice to customers, improvement / recovery plan; also tracking of “change history/chronological events”
• To develop & evaluate project critical success factors, set up quality criteria/ spec/ measurement methods – with alignment with customers.
• To propose/ generate technology roadmap/ assembly design rule related to the assigned sector/ responsible field.
• Material Inventory management on non-qualified material to ensure on time availability of both Direct & Indirect Materials.
• Coordinate on the readiness of Equipment / change-kit / tooling requirement. Automation know how to support productivity & quality.
• Good presentation skill, positive mindset, team player, manage diverse relationship.
• To review results/ KRA of development projects, individual members & overall Team performance vs set goals
• Resource management – timely justification & recruitment of suitable team members (internally & externally)
• Knowledge on Problem solving, Process capability study, Package/ Process design, Material technology, Equipment engineering, FMEA/ 4M/ 8D/ DOE/ SPC, etc.
• Any others as need arises.
• Any other duties assigned by immediate superior

Requirement

• Semiconductor Packaging Experience, both Front of Line & End of line experience will be added advantages
• Semiconductor Packaging Equipment Knowledge & Hand On
• New Semiconductor Advance Packaging Knowledge
• Leadframe / Substrate Design Knowledge
• DOE & Statistic Analysis for problem solving
• Project Management Skill
• Good Presentation Skill

The successful candidate is someone who (is)

• Planning skills
• Communication and presentation skills
• Project evaluation skills
• We are offering position based in Ipoh
• A competitive compensation package
• Countryside living within a city
• Competitive perks and benefits

We are offering position based in Ipoh

• A competitive compensation package
• Countryside living within a city
• Competitive perks and benefits