Carsem offers a variety of JEDEC compliant QFP (Quad Flat Package) for medium to high pin count IC’s. The MQFP is available in body sizes ranging from 10 x 10mm to 14 x 20mm with lead counts from 24 to 100. The LQFP is a family of low profile packages with body sizes ranging from 7 x 7mm to 10 x 10mm and lead counts from 32 to 64.
Availability
MQFP (Metric Quad Flat Pack)
| Body (mm) | Lead Count |
| 10 x 10 | 44/52 |
| 14 x 20 | 64/80/100/128 |
LQFP (1.4mm) (Low Profile Quad Flat Pack)
| Body (mm) | Lead Count |
| 7 x 7 | 32/48 |
| 10 x 10 | 44/52/64 |
Bill of Material
| MLPQ/D – EP | MLPQ/D – COL | |
| Leadframe | C7025 / EFTEC64T | |
| Die Attach | 84-1 LMI-SR4 | |
| Wire Bond | 1.0 / 1.2 / 1.3mils gold wire | |
| Mold Compound | G600 Series (Green) | G700 Series (Green) |
| Lead Finish | 100% matte Tin or NIPDAU | |
| Marking | Laser | |
| Packing (JEDEC Trays) | Bakeable – Thin Profile Non-bakeable – Thin Profile |
|
| Process Flow | CFC-QFP-LTM-NSD (Dry Pack) | CFC-QFP-NSD-DP (Dry Pack) |
| CFC-QFP-LTM (No Dry Pack) | CFC-QFP-NSD-NDP (No Dry Pack) | |
| JEDEC Reference | MS-022 3.2mm Footprint MO-112 3.9mm Footprint MO-143 2.6mm Footprint |
MS-026 2.0mm Footprint |
Package Performance
Reliability Data
| References Specifications | ||
| Mil Standard 883 for Test Method and Procedures | ||
| J-STD-20 Moisture/Reflow Sensitivity Classfication | ||
| JESD 22- A113 for Preconditioning for Moisture/Reflow Sensitivity Classification |
| Reference Specifications | ||
| Autoclave | 1008 hours | 121°C / 100% RH, 2 atm |
| Temp. Cycle | 1000 cycles | -65°C / +150°C |
| Thermal Shock | 300 cycles | -55°C / +125°C |
Reliability & MSL Results
| Please Contact Sales Office for Package Specific Results |
Thermal Data
Electrical Data