Combining MLP multi chip module (MCM) and RF test capability, Carsem is able to offer full turnkey solutions for MLP RF devices. MCM allows a single unit to be multi-functional, e.g. amplifiers, filters, switches, etc.
Applications
- Solutions for Wireless and handheld portable devices
- Front-End-Module, Power Amplifier (WLAN/Cellular), Switches, Transceivers.
MLP-RF Features
Aluminium Nitride Stack
SiP
Carsem’s SiP (System in Package) is the advanced technology of placing multiple ICs and passive components into a single package. Our services include design, modeling as well as final test including RF testing of Bluetooth and WLAN applications.
Features
- Package construction : Leadframe and Laminate based
- Package size up to 12×12 mm
- Terminal Pitches as fine as 0.4mm
- Package Thickness from 0.5 mm to 2.5 mm
- Flip chip, wire bond and stacked die capabilities
- Ability to mount passive components as small as 0201
Applications
There is an almost endless list of potential SiP applications and some examples are:
- BluetoothTM Wireless Devices
- 802.11 WLAN Applications
- Power Management Devices
- GPS Modules
- Internet Mini-Systems
For more information please contact your local sales office.