Multi Chip Modules (MCM)

A multi-chip module (MCM) is a specialized electronic package where multiple Integrated circuits (ICs), semiconductor dies or other discrete components are packaged onto a unifying leadframe or substrate, facilitating their use as a single assembled component. MCM technology eliminates the need for multiple packages which can significantly reduce inter-package propagation delay, power consumption of the system and overall footprint.

Applications

With ever increasing demands for miniaturization and higher operating speeds, multi-chip module systems (MCMs) become increasingly attractive in a variety of applications. The “chip-stack” package, a development in MCM technology, is an attractive option in many applications such cell phones, smart phones and tablets.

Benefits of Multi-Chip Modules

  • Lower power consumption
  • Smaller package sizes enable greater miniaturization
  • Greater reliability with decreased number of interconnects between components
  • Flexibility through integration of  differing  semiconductor technology
  • Faster time-to-market (ideal for product with short life cycles)
  • Simplification of complexity by putting several devices into a single package
  • Lower cost
  • Smaller overall footprint that multi-individual packages

Applications for MCMs include

  • RF wireless modules
  • Power amplifiers
  • High-power communication devices
  • LED Arrays
  • High-density single module computers
  • Servers
  • Portable electronics
  • Wearable computers
  • Military and space avionics
  • Automotive

MCM / SiP

  • Efficient Strip Processing (HD Format)
  • Multi Die Capability
    1. Reduced Clearance Die To Die Spacing
    2. Stacked Die Capability
  • Attach Processes
    1. Chip Shooters For SMT Component Attach
    2. Solder Paste: SMT / Die / Cu Clip Attach
    3. Epoxy Die Attach – Dispense And COL
    4. Epoxy Die Attach – Solder Replacement (Development Activity)
  • Interconnect Processes
    1. Flipchip – Solder Bumps / Cu Pillar Bumps
    2. Flip-Fels – Solder Paste
    3. Wirebond – Au and Cu Wire Capable – Multiple Wire Sizes
  • Increased Routability
    eMLP – Qualifications Underway
    xDap – Under Evaluation

MLP RF - MCM Features

  • Multi-die capability
  • Thermal management solutions
  • RF Wire Loop & Ultra-low Wire loop control
  • Typical package sizes : 2×2 to 7×7
  • Package Heights as low as 0.8mm
  • Let Carsem design your custom configuration today!